Research Interests
Metal matrix composites
Thermally conductive composites
Electronic packaging materials
Heat transfer at micro/nano interface
Education Background
Xi’an Jiaotong University, Xi’an, P. R. China, Ph.D., Materials Science -2003
North University of China, Taiyuan, P. R. China , M.Eng., Materials Engineering - 1999
North University of China, Taiyuan, P. R. China, B.Sc., Materials Science-1996
Work Experience
University of Science and Technology Beijing, Beijing, P. R. China
Professor, State Key Laboratory for Advanced Metals and Materials 2012 – present
Associate Professor, Division of Materials Science and Engineering 2006 – 2012
Assistant Professor, Division of Materials Science and Engineering 2005 – 2006
Tsinghua University, Beijing, P. R. China
Postdoctoral, Division of Materials Science and Engineering 2003 – 2005
University of Texas at Dallas, Richardson, USA
Visiting Scientist, Division of Materials Science 2016.07 – 2016.09
Technische Universität Darmstadt, Darmstadt, Germany
Visiting Scientist, Division of Materials Science 2011.04 – 2012.04
La Trobe University, Bendigo, Australia
Visiting Scientist, Division of Education – Bendigo 2008.06 – 2008.09
Honors and Awards
Recipient of the New Century Excellent Talents in University Awards December 2010
Award given to a below 40-year-old academic who has made outstanding contributions to teaching or scientific research, by the Ministry of Education, China
Recipient of the Beijing Scientific Nova Awards October 2007
Award given to a below 35-year-old academic who has made outstanding contributions to scientific research, by the Beijing Municipal Commission of Science and Technology, China
Selected Publications
[1] N. Li, Y. J. Zhang, Y. Zhang, X. T. Wang, H. J. Wu*, L. D. Zhao*, H. L. Zhang*: Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering, Materials Today Physics, 28 (2022) 100901
[2] J. J. Wang, S. F. Zhang, Y. F. Li, C. Y. Wu, W. F. Zhang*, H. L. Zhang*, Z. Xie*, S. Y. Zhou: Ultra-broadband random laser and white-light emissive carbon dots/crystal in-situ hybrids, Small, 18(41) (2022) 2203152
[3] Y. J. Zhang, Z. Y. Wang, N. Li, Z. X. Che, X. Y. Liu, G. Chang, J. P. Hao, J. J. Dai, X. T. Wang, F. Y. Sun*, H. L. Zhang*: Interfacial thermal conductance betweeen Cu and diamond with interconnected W/W2C interlayer, ACS Applied Materials & Interfaces, 14(30) (2022) 35215-35228
[4] Y. J. Zhang, G. Z. Bai, X.Y. Liu, J. J. Dai, X. T. Wang, H. L. Zhang*: Reinforcement size effect on thermal conductivity in Cu-B/diamond composite, Journal of Materials Science & Technology, 91 (2021) 1-4
[5] G. Chang, F. Y. Sun*, L. H. Wang, Z. X. Che, X. T. Wang, J. G. Wang, M. J. Kim, H. L. Zhang*: Regulated interfacial thermal conductance between Cu and diamond by a TiC interlayer for thermal management applications, ACS Applied Materials & Interfaces, 11(29) (2019) 26507-26517
[6] G. Chang, F. Y. Sun, J. L. Duan, Z. F. Che, X. T. Wang, J. G. Wang, M. J. Kim, H. L. Zhang*: Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond, Acta Materialia, 160 (2018) 235-246
[7] L. H. Wang, J. W. Li, M. Catalano, G. Z. Bai, N. Li, J. J. Dai, X. T. Wang, H. L. Zhang*, J. G. Wang*, M. J. Kim*: Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer, Composites Part A, 113 (2018) 76-82
[8] J. W. Li, X. T. Wang, Y. Qiao, Y. Zhang, Z. B. He, H. L. Zhang*: High thermal conductivity through layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites, Scripta Materialia, 109 (2015) 72-75
[9] H. L. Zhang, J. F. Li*, B. P. Zhang: Microstructure and electrical properties of porous PZT ceramics derived from different pore-forming agents, Acta Materialia, 55(1) (2007) 171-181
[10] H. L. Zhang, J. F. Li*, B. P. Zhang, K. F. Yao, W. S. Liu, H. Wang: Electrical and thermal properties of carbon nanotube bulk materials: Experimental studies for the 328K-958K temperature range, Physical Review B, 75(20) (2007) 205407
Research project
As the chief-scientist, research has been funded in recent years by several national projects:
A general project entitled “Regulation mechanism and thermal conducting theory of in-situ discontinuous interface layer in Cu/diamond composites” (No. 52171132), 2022.01－2025.12, funded by the National Natural Science Foundation of China (NSFC)
A general project entitled “Interface control and thermal conductive mechanism of three-dimensional interconnecting graphene network reinforced aluminum matrix composites” (No. 51871014), 2019.01－2022.12, funded by the NSFC
A general project entitled “Microscale heat conduction in nano-sized copper/carbide/diamond multilayers” (No. 51571015), 2016.01－2019.12, funded by the NSFC
A general project entitled “Thermal conductivity of diamond particles reinforced copper matrix composites with a compositionally graded interface” (No. 51271017), 2013.01－2016.12, funded by the NSFC
A young scientist project entitled “Functionally graded piezoelectric actuator based on metal particles reinforced piezoceramic composites” (No. 50402002), 2005.01－2005.12, funded by the NSFC
A high-tech 863 program of China entitled “A novel functionally graded piezoelectric actuator” (No. 2006AA03Z436), 2006.12－2008.12, funded by the Ministry of Science and Technology of China
Academic Services
Research advisor for PhD and Master students
Member, Professional Committee of Thermally conductive Materials, Chinese Society for Composite Materials
Editorial member, Materials
